SN74SSTVF32852KR
vs
PI74SSTVF32852NBE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
PERICOM SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
PLASTIC, BGA-114
LFBGA, BGA114,6X19,32
Pin Count
114
114
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
SSTV
SSTV
JESD-30 Code
R-PBGA-B114
R-PBGA-B114
JESD-609 Code
e0
e1
Length
16 mm
16 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Max Frequency@Nom-Sup
500000000 Hz
Max I(ol)
0.008 A
Moisture Sensitivity Level
3
3
Number of Bits
24
24
Number of Functions
1
1
Number of Terminals
114
114
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA114,6X19,32
BGA114,6X19,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Packing Method
TR
Peak Reflow Temperature (Cel)
220
260
Prop. Delay@Nom-Sup
2.6 ns
Propagation Delay (tpd)
2.6 ns
2.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.45 mm
Supply Voltage-Max (Vsup)
2.7 V
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
TTL
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
40
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
5.5 mm
5.5 mm
fmax-Min
500 MHz
210 MHz
Base Number Matches
1
1
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