SN74S133FN
vs
HD74LS38P-E
feature comparison
| Part Life Cycle Code |
Contact Manufacturer
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
RENESAS ELECTRONICS CORP
|
| Package Description |
QCCJ,
|
DIP, DIP14,.3
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
S
|
LS
|
| JESD-30 Code |
S-PQCC-J20
|
R-PDIP-T14
|
| Length |
8.9662 mm
|
19.2 mm
|
| Logic IC Type |
NAND GATE
|
NAND GATE
|
| Number of Functions |
1
|
4
|
| Number of Inputs |
13
|
2
|
| Number of Terminals |
20
|
14
|
| Operating Temperature-Max |
70 °C
|
75 °C
|
| Operating Temperature-Min |
|
-20 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
DIP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Propagation Delay (tpd) |
7 ns
|
32 ns
|
| Seated Height-Max |
4.57 mm
|
5.06 mm
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL EXTENDED
|
| Terminal Form |
J BEND
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
8.9662 mm
|
7.62 mm
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
14
|
| Load Capacitance (CL) |
|
45 pF
|
| Max I(ol) |
|
0.024 A
|
| Moisture Sensitivity Level |
|
1
|
| Output Characteristics |
|
OPEN-COLLECTOR
|
| Package Equivalence Code |
|
DIP14,.3
|
| Power Supply Current-Max (ICC) |
|
12 mA
|
| Prop. Delay@Nom-Sup |
|
32 ns
|
| Qualification Status |
|
Not Qualified
|
| Schmitt Trigger |
|
NO
|
|
|
|
Compare SN74S133FN with alternatives
Compare HD74LS38P-E with alternatives