SN74LVTH322374KR
vs
74LVT32374EC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
NXP SEMICONDUCTORS
Part Package Code
BGA
BGA
Package Description
PLASTIC, LFBGA-96
LFBGA, BGA96,6X16,32
Pin Count
96
96
Reach Compliance Code
not_compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Texas Instruments
Family
LVT
LVT
JESD-30 Code
R-PBGA-B96
R-PBGA-B96
JESD-609 Code
e0
e0
Length
13.5 mm
13.5 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Max Frequency@Nom-Sup
160000000 Hz
150000000 Hz
Max I(ol)
0.012 A
0.064 A
Moisture Sensitivity Level
2
4
Number of Bits
8
8
Number of Functions
4
4
Number of Ports
2
2
Number of Terminals
96
96
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE WITH SERIES RESISTOR
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA96,6X16,32
BGA96,6X16,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Packing Method
TR
Peak Reflow Temperature (Cel)
235
260
Prop. Delay@Nom-Sup
5.3 ns
5.3 ns
Propagation Delay (tpd)
6.2 ns
6.2 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.5 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
BICMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn63Pb37)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
30
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
5.5 mm
5.5 mm
Base Number Matches
1
2
Manufacturer Package Code
SOT-536-1
Compare SN74LVTH322374KR with alternatives
Compare 74LVT32374EC with alternatives