SN74LVTH244AGQNR
vs
DM74AS760SJX
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NATIONAL SEMICONDUCTOR CORP
|
Part Package Code |
BGA
|
SOIC
|
Package Description |
PLASTIC, VFBGA-20
|
SOP,
|
Pin Count |
20
|
20
|
Reach Compliance Code |
not_compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Control Type |
ENABLE LOW
|
|
Family |
LVT
|
AS
|
JESD-30 Code |
R-PBGA-B20
|
R-PDSO-G20
|
JESD-609 Code |
e0
|
|
Length |
4 mm
|
12.6 mm
|
Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
Max I(ol) |
0.064 A
|
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
4
|
4
|
Number of Functions |
2
|
2
|
Number of Ports |
2
|
2
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Output Characteristics |
3-STATE
|
OPEN-COLLECTOR
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
SOP
|
Package Equivalence Code |
BGA20,4X5,25
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE
|
Packing Method |
TR
|
|
Peak Reflow Temperature (Cel) |
240
|
|
Prop. Delay@Nom-Sup |
3.5 ns
|
|
Propagation Delay (tpd) |
3.8 ns
|
7 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
2.108 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
TTL
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
DUAL
|
Width |
3 mm
|
5.3 mm
|
Base Number Matches |
1
|
1
|
Load Capacitance (CL) |
|
50 pF
|
Power Supply Current-Max (ICC) |
|
94 mA
|
|
|
|
Compare SN74LVTH244AGQNR with alternatives
Compare DM74AS760SJX with alternatives