SN74LVCH16373AZRDR vs 74ALVCH16373DGG,118 feature comparison

SN74LVCH16373AZRDR Texas Instruments

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74ALVCH16373DGG,118 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code BGA TSSOP
Package Description LEAD FREE, FBGA-54 6.10 MM, PLASTIC, MO-153, SOT362-1, TSSOP-48
Pin Count 54 48
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z ALVC/VCX/A
JESD-30 Code R-PBGA-B54 R-PDSO-G48
JESD-609 Code e1
Length 8 mm 12.5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.024 A 0.024 A
Moisture Sensitivity Level 1
Number of Bits 8 8
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 54 48
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TSSOP
Package Equivalence Code BGA54,6X9,32 TSSOP48,.3,20
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 4.2 ns
Propagation Delay (tpd) 5.3 ns 5.9 ns
Qualification Status Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.65 V 1.2 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL GULL WING
Terminal Pitch 0.8 mm 0.5 mm
Terminal Position BOTTOM DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 5.5 mm 6.1 mm
Base Number Matches 1 2
Control Type ENABLE LOW
Count Direction UNIDIRECTIONAL
Power Supply Current-Max (ICC) 0.04 mA

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