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SN74LVC2G34DCKT vs 74LVC2G34GW,125 feature comparison

SN74LVC2G34DCKT Texas Instruments

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74LVC2G34GW,125 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code SOIC TSSOP
Package Description TSSOP, TSSOP6,.08 PLASTIC, SC-88, SOT-363, 6 PIN
Pin Count 6 6
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G6 R-PDSO-G6
Length 2 mm 2 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUFFER BUFFER
Max I(ol) 0.024 A
Number of Functions 2 2
Number of Inputs 1 1
Number of Terminals 6 6
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP6,.08 TSSOP6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR TR
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Prop. Delay@Nom-Sup 4.1 ns
Propagation Delay (tpd) 8.6 ns 10.8 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 1.25 mm 1.25 mm
Base Number Matches 1 2
Manufacturer Package Code SOT363
ECCN Code EAR99
JESD-609 Code e3
Moisture Sensitivity Level 1
Terminal Finish Tin (Sn)
Logic » Gates
Logic » Gates

Compare SN74LVC2G34DCKT with alternatives

Compare 74LVC2G34GW,125 with alternatives