SN74LVC2G32DCUR
vs
TC7WZ32FK(TE85L,F)
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS INC
TOSHIBA CORP
Part Package Code
SOIC
Package Description
VSSOP,
VSSOP, TSSOP8,.12,20
Pin Count
8
Reach Compliance Code
unknown
unknown
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
JESD-609 Code
e1
Length
2.3 mm
2.3 mm
Logic IC Type
OR GATE
OR GATE
Moisture Sensitivity Level
1
Number of Functions
2
2
Number of Inputs
2
2
Number of Terminals
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VSSOP
VSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Propagation Delay (tpd)
8 ns
11 ns
Seated Height-Max
0.9 mm
0.9 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
1.8 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
2 mm
2 mm
Base Number Matches
2
1
Rohs Code
Load Capacitance (CL)
50 pF
Max I(ol)
0.024 A
Package Equivalence Code
TSSOP8,.12,20
Packing Method
TR
Prop. Delay@Nom-Sup
5.2 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
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