SN74LVC2G32DCUR
vs
74LVC2G32DC,125
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
ROCHESTER ELECTRONICS INC
NXP SEMICONDUCTORS
Part Package Code
SOIC
SSOP
Package Description
VSSOP,
2.30 MM, PLASTIC, MO-187, SOT-765-1, VSSOP-8
Pin Count
8
8
Reach Compliance Code
unknown
compliant
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
JESD-609 Code
e1
e4
Length
2.3 mm
2.3 mm
Logic IC Type
OR GATE
OR GATE
Moisture Sensitivity Level
1
1
Number of Functions
2
2
Number of Inputs
2
2
Number of Terminals
8
8
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VSSOP
VSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
260
Propagation Delay (tpd)
8 ns
11 ns
Seated Height-Max
0.9 mm
1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
1.8 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
TIN SILVER COPPER
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
30
Width
2 mm
2 mm
Base Number Matches
2
2
Rohs Code
Manufacturer Package Code
SOT765-1
HTS Code
8542.39.00.01
Factory Lead Time
4 Weeks
Package Equivalence Code
TSSOP8,.12,20
Packing Method
TR
Qualification Status
Not Qualified
Schmitt Trigger
NO
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