SN74LVC2G17YZPR vs 74LVC2G07GV-Q100,125 feature comparison

SN74LVC2G17YZPR Rochester Electronics LLC

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74LVC2G07GV-Q100,125 NXP Semiconductors

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Pbfree Code No
Rohs Code Yes
Part Life Cycle Code Active Active
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Part Package Code BGA
Package Description GREEN, DSBGA-6 TSOP,
Pin Count 6
Reach Compliance Code unknown unknown
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-XBGA-B6 R-PDSO-G6
JESD-609 Code e1
Length 1.4 mm 2.9 mm
Logic IC Type BUFFER BUFFER
Moisture Sensitivity Level 1
Number of Functions 2 2
Number of Inputs 1 1
Number of Terminals 6 6
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code VFBGA TSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 9.3 ns 8.4 ns
Seated Height-Max 0.5 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN SILVER COPPER
Terminal Form BALL GULL WING
Terminal Pitch 0.5 mm 0.95 mm
Terminal Position BOTTOM DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 0.9 mm 1.5 mm
Base Number Matches 2 1
HTS Code 8542.39.00.01
Output Characteristics OPEN-DRAIN
Screening Level AEC-Q100

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