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SN74LVC2G17YZPR vs 74LVC2G34GW,125 feature comparison

SN74LVC2G17YZPR Texas Instruments

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74LVC2G34GW,125 NXP Semiconductors

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code BGA TSSOP
Package Description VFBGA, BGA6,2X3,20 PLASTIC, SC-88, SOT-363, 6 PIN
Pin Count 6 6
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Texas Instruments
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-XBGA-B6 R-PDSO-G6
JESD-609 Code e1 e3
Length 1.4 mm 2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUFFER BUFFER
Max I(ol) 0.032 A 0.024 A
Moisture Sensitivity Level 1 1
Number of Functions 2 2
Number of Inputs 1 1
Number of Terminals 6 6
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code VFBGA TSSOP
Package Equivalence Code BGA6,2X3,20 TSSOP6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 260
Power Supply Current-Max (ICC) 0.01 mA
Prop. Delay@Nom-Sup 5.4 ns 5.1 ns
Propagation Delay (tpd) 9.3 ns 10.8 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES NO
Seated Height-Max 0.5 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN SILVER COPPER Tin (Sn)
Terminal Form BALL GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position BOTTOM DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 0.9 mm 1.25 mm
Base Number Matches 1 1
Manufacturer Package Code SOT363
Logic » Gates
Logic » Gates

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