SN74LVC2G17YZPR vs 74LVC2G07GV-Q100,125 feature comparison

SN74LVC2G17YZPR Texas Instruments

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74LVC2G07GV-Q100,125 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Active
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code BGA
Package Description VFBGA, BGA6,2X3,20 TSOP,
Pin Count 6
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Texas Instruments
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-XBGA-B6 R-PDSO-G6
JESD-609 Code e1
Length 1.4 mm 2.9 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUFFER BUFFER
Max I(ol) 0.032 A
Moisture Sensitivity Level 1
Number of Functions 2 2
Number of Inputs 1 1
Number of Terminals 6 6
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code VFBGA TSOP
Package Equivalence Code BGA6,2X3,20
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 0.01 mA
Prop. Delay@Nom-Sup 5.4 ns
Propagation Delay (tpd) 9.3 ns 8.4 ns
Qualification Status Not Qualified
Schmitt Trigger YES
Seated Height-Max 0.5 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN SILVER COPPER
Terminal Form BALL GULL WING
Terminal Pitch 0.5 mm 0.95 mm
Terminal Position BOTTOM DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 0.9 mm 1.5 mm
Base Number Matches 1 1
Output Characteristics OPEN-DRAIN
Screening Level AEC-Q100

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Compare 74LVC2G07GV-Q100,125 with alternatives