SN74LVC2G17YZPR
vs
74LVC2G07GV
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
TEXAS INSTRUMENTS INC
NXP SEMICONDUCTORS
Part Package Code
BGA
TSOP
Package Description
VFBGA, BGA6,2X3,20
PLASTIC, SC-74, SOT-457, TSOP-6
Pin Count
6
6
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Texas Instruments
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-XBGA-B6
R-PDSO-G6
JESD-609 Code
e1
e3
Length
1.4 mm
2.9 mm
Load Capacitance (CL)
50 pF
Logic IC Type
BUFFER
BUFFER
Max I(ol)
0.032 A
Moisture Sensitivity Level
1
1
Number of Functions
2
2
Number of Inputs
1
1
Number of Terminals
6
6
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
VFBGA
TSSOP
Package Equivalence Code
BGA6,2X3,20
TSOP6,.11,37
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TR
Peak Reflow Temperature (Cel)
260
260
Power Supply Current-Max (ICC)
0.01 mA
Prop. Delay@Nom-Sup
5.4 ns
Propagation Delay (tpd)
9.3 ns
8.4 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
YES
NO
Seated Height-Max
0.5 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Tin (Sn)
Terminal Form
BALL
GULL WING
Terminal Pitch
0.5 mm
0.95 mm
Terminal Position
BOTTOM
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
0.9 mm
1.5 mm
Base Number Matches
1
5
Output Characteristics
OPEN-COLLECTOR
Compare SN74LVC2G17YZPR with alternatives
Compare 74LVC2G07GV with alternatives