SN74LVC2G157YZPR vs 74LVC158PW feature comparison

SN74LVC2G157YZPR Texas Instruments

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74LVC158PW NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code BGA
Package Description GREEN, DSBGA-8 TSSOP,
Pin Count 8
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Texas Instruments
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-XBGA-B8 R-PDSO-G16
JESD-609 Code e1
Length 1.9 mm 5 mm
Load Capacitance (CL) 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.032 A
Moisture Sensitivity Level 1
Number of Bits 2
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 8 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE
Output Polarity COMPLEMENTARY INVERTED
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code VFBGA TSSOP
Package Equivalence Code BGA8,2X4,20
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 0.01 mA
Prop. Delay@Nom-Sup 6 ns
Propagation Delay (tpd) 14 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 1.65 V 2.7 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position BOTTOM DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 0.9 mm 4.4 mm
Base Number Matches 1 1

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Compare 74LVC158PW with alternatives