SN74LVC257ARGYRG4
vs
MC74LCX158DR2
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
TEXAS INSTRUMENTS INC
MOTOROLA INC
Part Package Code
QFN
Package Description
HVQCCN, LCC16/20,.14X.16,20
SOP,
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PQCC-N16
R-PDSO-G16
JESD-609 Code
e4
Length
4 mm
9.9 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.024 A
Moisture Sensitivity Level
2
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
Output Polarity
TRUE
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
SOP
Package Equivalence Code
LCC16/20,.14X.16,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
4.6 ns
Propagation Delay (tpd)
13.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1.75 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
1.65 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
1.27 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3.5 mm
3.9 mm
Base Number Matches
1
3
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