SN74LVC257AQDRG4Q1
vs
74LCX157CW
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
ON SEMICONDUCTOR
|
Part Package Code |
SOIC
|
|
Package Description |
SOP, SOP16,.25
|
DIE,
|
Pin Count |
16
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
|
Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
JESD-30 Code |
R-PDSO-G16
|
R-XUUC-N16
|
JESD-609 Code |
e4
|
|
Length |
9.9 mm
|
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Max I(ol) |
0.024 A
|
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
2
|
|
Number of Functions |
4
|
4
|
Number of Inputs |
2
|
2
|
Number of Outputs |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Output Characteristics |
3-STATE
|
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
SOP
|
DIE
|
Package Equivalence Code |
SOP16,.25
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
UNCASED CHIP
|
Packing Method |
TR
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Power Supply Current-Max (ICC) |
0.01 mA
|
|
Prop. Delay@Nom-Sup |
4.6 ns
|
|
Propagation Delay (tpd) |
5.4 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
AEC-Q100
|
|
Seated Height-Max |
1.75 mm
|
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
2.7 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
DUAL
|
UPPER
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
3.9 mm
|
|
Base Number Matches |
1
|
2
|
Manufacturer Package Code |
|
N/A
|
|
|
|
Compare SN74LVC257AQDRG4Q1 with alternatives
Compare 74LCX157CW with alternatives