SN74LVC1G66YEPR
vs
NC7SZ3157P6X
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
FAIRCHILD SEMICONDUCTOR CORP
Part Package Code
BGA
SOIC
Package Description
DSBGA-5
TSSOP, TSSOP6,.08
Pin Count
5
6
Reach Compliance Code
unknown
unknown
Analog IC - Other Type
SPST
DIFFERENTIAL MULTIPLEXER
JESD-30 Code
R-XBGA-B5
R-PDSO-G6
JESD-609 Code
e0
e0
Length
1.4 mm
2 mm
Moisture Sensitivity Level
1
Number of Channels
1
1
Number of Functions
1
1
Number of Terminals
5
6
Off-state Isolation-Nom
42 dB
On-state Resistance-Max (Ron)
20 Ω
30 Ω
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
VFBGA
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
Seated Height-Max
0.5 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
2.3 V
3.3 V
Surface Mount
YES
YES
Switch-off Time-Max
6.9 ns
8 ns
Switch-on Time-Max
6.5 ns
15 ns
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
GULL WING
Terminal Pitch
0.5 mm
0.65 mm
Terminal Position
BOTTOM
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
0.9 mm
1.25 mm
Base Number Matches
2
1
HTS Code
8542.39.00.01
Output
COMMON OUTPUT
Package Equivalence Code
TSSOP6,.08
Qualification Status
Not Qualified
Switching
BREAK-BEFORE-MAKE
Compare SN74LVC1G66YEPR with alternatives
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