SN74LVC1G17DSFR
vs
74LVC1G17GW-Q100,125
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
TEXAS INSTRUMENTS INC
NXP SEMICONDUCTORS
Part Package Code
SON
Package Description
GREEN, PLASTIC , MO-287X2AAF, SON-6
TSSOP,
Pin Count
6
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Texas Instruments
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
S-PDSO-N6
R-PDSO-G5
JESD-609 Code
e4
Length
1 mm
2.05 mm
Load Capacitance (CL)
50 pF
Logic IC Type
BUFFER
BUFFER
Max I(ol)
0.024 A
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Inputs
1
1
Number of Terminals
6
5
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VSON
TSSOP
Package Equivalence Code
SOLCC6,.04,14
Package Shape
SQUARE
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Power Supply Current-Max (ICC)
0.01 mA
Prop. Delay@Nom-Sup
5.5 ns
Propagation Delay (tpd)
11 ns
14 ns
Qualification Status
Not Qualified
Schmitt Trigger
YES
Seated Height-Max
0.4 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.35 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
1 mm
1.25 mm
Base Number Matches
1
2
Screening Level
AEC-Q100
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