SN74LVC1G17DBVRE4
vs
74LVC1G17GV
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
TEXAS INSTRUMENTS INC
PHILIPS SEMICONDUCTORS
Part Package Code
SOT-23
Package Description
LSSOP, TSOP5/6,.11,37
Pin Count
5
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Texas Instruments
Family
LVC/LCX/Z
JESD-30 Code
R-PDSO-G5
R-PDSO-G5
JESD-609 Code
e4
e0
Length
2.9 mm
Load Capacitance (CL)
50 pF
Logic IC Type
BUFFER
BUFFER
Max I(ol)
0.024 A
Moisture Sensitivity Level
1
Number of Functions
1
Number of Inputs
1
Number of Terminals
5
5
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LSSOP
TSOP
Package Equivalence Code
TSOP5/6,.11,37
TSOP5/6,.11,37
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE
Packing Method
TR
TR
Peak Reflow Temperature (Cel)
260
Power Supply Current-Max (ICC)
0.01 mA
Prop. Delay@Nom-Sup
5.5 ns
Propagation Delay (tpd)
11 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
YES
YES
Seated Height-Max
1.45 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.95 mm
0.95 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
1.6 mm
Base Number Matches
1
3
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