SN74LVC157DWR
vs
74LVC157ABQ
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
TEXAS INSTRUMENTS INC
NXP SEMICONDUCTORS
Package Description
SOP,
HVQCCN, LCC16,.1X.14,20
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G16
R-PQCC-N16
Length
10.3 mm
3.5 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
HVQCCN
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.65 mm
1 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
1.2 V
Supply Voltage-Nom (Vsup)
3.3 V
2.7 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
1.27 mm
0.5 mm
Terminal Position
DUAL
QUAD
Width
7.5 mm
2.5 mm
Base Number Matches
1
3
Pbfree Code
Rohs Code
Part Package Code
QFN
Pin Count
16
JESD-609 Code
e4
Load Capacitance (CL)
50 pF
Max I(ol)
0.024 A
Moisture Sensitivity Level
1
Package Equivalence Code
LCC16,.1X.14,20
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
6.5 ns
Propagation Delay (tpd)
7.5 ns
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)
30
Compare SN74LVC157DWR with alternatives
Compare 74LVC157ABQ with alternatives