SN74LVC139APWR
vs
M74HC154B1N
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
STMICROELECTRONICS
Part Package Code
TSSOP
DIP
Package Description
TSSOP-16
DIP, DIP24,.3
Pin Count
16
24
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Texas Instruments
Family
LVC/LCX/Z
HC/UH
Input Conditioning
STANDARD
STANDARD
JESD-30 Code
R-PDSO-G16
R-PDIP-T24
JESD-609 Code
e4
e0
Length
5 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
2-LINE TO 4-LINE DECODER
4-LINE TO 16-LINE DECODER
Max I(ol)
0.024 A
0.004 A
Moisture Sensitivity Level
1
Number of Bits
4
Number of Functions
2
1
Number of Terminals
16
24
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
DIP
Package Equivalence Code
TSSOP16,.25
DIP24,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
IN-LINE
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Power Supply Current-Max (ICC)
0.04 mA
Prop. Delay@Nom-Sup
6.2 ns
50 ns
Propagation Delay (tpd)
20.6 ns
250 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
3.93 mm
Supply Voltage-Max (Vsup)
3.6 V
6 V
Supply Voltage-Min (Vsup)
1.65 V
2 V
Supply Voltage-Nom (Vsup)
1.8 V
4.5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.65 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
4.4 mm
7.62 mm
Base Number Matches
1
1
Additional Feature
2 ENABLE INPUTS
Compare SN74LVC139APWR with alternatives
Compare M74HC154B1N with alternatives