SN74LVC10APWTG4
vs
N74LVC10PW-T
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
NXP SEMICONDUCTORS
Part Package Code
TSSOP
Package Description
TSSOP, TSSOP14,.25
TSSOP,
Pin Count
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e4
Length
5 mm
5 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.024 A
Moisture Sensitivity Level
1
Number of Functions
3
3
Number of Inputs
3
3
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
6 ns
Propagation Delay (tpd)
12.1 ns
6.4 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
1.2 mm
1.1 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
1.65 V
1.2 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
4.4 mm
4.4 mm
Base Number Matches
1
1
Compare SN74LVC10APWTG4 with alternatives
Compare N74LVC10PW-T with alternatives