SN74LVC08DBR
vs
74LVC08APW,118
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
TEXAS INSTRUMENTS INC
NXP SEMICONDUCTORS
Part Package Code
SSOP
TSSOP
Package Description
SSOP,
Pin Count
14
14
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
Length
6.2 mm
5 mm
Logic IC Type
AND GATE
AND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)
7 ns
9 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2 mm
1.1 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2 V
1.2 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
5.3 mm
4.4 mm
Base Number Matches
1
2
Rohs Code
Yes
Manufacturer Package Code
SOT402-1
JESD-609 Code
e4
Load Capacitance (CL)
50 pF
Max I(ol)
0.024 A
Moisture Sensitivity Level
1
Package Equivalence Code
TSSOP14,.25
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
4.8 ns
Schmitt Trigger
NO
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)
30
Compare SN74LVC08DBR with alternatives
Compare 74LVC08APW,118 with alternatives
74LVC08APW,118 vs SN74LVC08APWT
74LVC08APW,118 vs 74LVC08APW/G,118
74LVC08APW,118 vs 935299055118
74LVC08APW,118 vs 74LVC08APW-Q100,11
74LVC08APW,118 vs PI74LVC08ALE
74LVC08APW,118 vs 74LVC08APW
74LVC08APW,118 vs SN74LVC08APWTG4
74LVC08APW,118 vs N74LVC08APWDH
74LVC08APW,118 vs SN74LVC08APWG4