SN74LVC08ARGYRG4
vs
74LVC10APW-T
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
TEXAS INSTRUMENTS INC
PHILIPS SEMICONDUCTORS
Part Package Code
QFN
Package Description
HQCCN, LCC14/18,.14SQ,20
Pin Count
14
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Date Of Intro
1993-04-01
Samacsys Manufacturer
Texas Instruments
Family
LVC/LCX/Z
JESD-30 Code
S-PQCC-N14
R-PDSO-G14
JESD-609 Code
e4
Length
3.5 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
AND GATE
NAND GATE
Max I(ol)
0.024 A
0.024 A
Moisture Sensitivity Level
2
Number of Functions
4
Number of Inputs
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
TSSOP
Package Equivalence Code
LCC14/18,.14SQ,20
TSSOP14,.25
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
260
Power Supply Current-Max (ICC)
0.04 mA
Prop. Delay@Nom-Sup
5.5 ns
5.7 ns
Propagation Delay (tpd)
11.3 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
1 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.635 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3.5 mm
Base Number Matches
1
2
Packing Method
TR
Compare SN74LVC08ARGYRG4 with alternatives