SN74LV175ANSRG4
vs
TC74VHC175FW
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TOSHIBA CORP
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
SOP, SOP16,.3
|
SOP,
|
Pin Count |
16
|
16
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
LV/LV-A/LVX/H
|
AHC/VHC
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
JESD-609 Code |
e4
|
e0
|
Length |
10.2 mm
|
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Max Frequency@Nom-Sup |
45000000 Hz
|
|
Max I(ol) |
0.006 A
|
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
4
|
4
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Equivalence Code |
SOP16,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Packing Method |
TR
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Prop. Delay@Nom-Sup |
17 ns
|
|
Propagation Delay (tpd) |
27 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2 mm
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
|
Supply Voltage-Min (Vsup) |
2 V
|
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Width |
5.3 mm
|
|
fmax-Min |
125 MHz
|
|
Base Number Matches |
1
|
1
|
|
|
|
Compare SN74LV175ANSRG4 with alternatives
Compare TC74VHC175FW with alternatives