SN74LV157ADBRE4
vs
TC7WH157FU
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TOSHIBA CORP
Part Package Code
SOIC
SOIC
Package Description
SSOP, SSOP16,.3
LSSOP, TSSOP8,.16
Pin Count
16
8
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LV/LV-A/LVX/H
HC/UH
JESD-30 Code
R-PDSO-G16
R-PDSO-G8
JESD-609 Code
e4
Length
6.2 mm
2.9 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.006 A
0.004 A
Moisture Sensitivity Level
1
Number of Functions
4
1
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
LSSOP
Package Equivalence Code
SSOP16,.3
TSSOP8,.16
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Packing Method
TR
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
15 ns
15 ns
Propagation Delay (tpd)
22 ns
15 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2 mm
1.3 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
2.5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
5.3 mm
2.8 mm
Base Number Matches
1
1
Samacsys Manufacturer
Toshiba
Compare SN74LV157ADBRE4 with alternatives
Compare TC7WH157FU with alternatives