Findchips: Compare SN74LV08ADB vs 74LV08DB,118

SN74LV08ADB vs 74LV08DB,118 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	Yes
Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	TEXAS INSTRUMENTS INC	NXP SEMICONDUCTORS
Package Description	SSOP,	5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14
Reach Compliance Code	compliant	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	LV/LV-A/LVX/H	LV/LV-A/LVX/H
JESD-30 Code	R-PDSO-G14	R-PDSO-G14
JESD-609 Code	e4	e4
Length	6.2 mm	6.2 mm
Logic IC Type	AND GATE	AND GATE
Moisture Sensitivity Level	1	1
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	85 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	SSOP	SSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd)	20 ns	33 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	2 mm	2 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	2 V	1 V
Supply Voltage-Nom (Vsup)	2.5 V	3.3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	AUTOMOTIVE
Terminal Finish	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.65 mm	0.65 mm
Terminal Position	DUAL	DUAL
Width	5.3 mm	5.3 mm
Base Number Matches	1	2
Part Package Code		SSOP1
Pin Count		14
Manufacturer Package Code		SOT337-1
Load Capacitance (CL)		50 pF
Max I(ol)		0.006 A
Package Equivalence Code		SSOP14,.3
Packing Method		TR
Peak Reflow Temperature (Cel)		260
Prop. Delay@Nom-Sup		19 ns
Schmitt Trigger		NO
Time@Peak Reflow Temperature-Max (s)		30
	Logic » Gates	Logic » Gates