SN74LS606NS
vs
SN74LS157ND
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
MOTOROLA INC
Package Description
DIP, DIP28,.6
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
JESD-30 Code
R-PDIP-T28
R-PDIP-T16
JESD-609 Code
e0
e0
Logic IC Type
D FLIP-FLOP
MULTIPLEXER
Number of Functions
8
4
Number of Terminals
28
16
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP28,.6
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
Base Number Matches
3
3
Part Package Code
DIP
Pin Count
16
HTS Code
8542.39.00.01
Family
LS
Length
19.175 mm
Load Capacitance (CL)
15 pF
Max I(ol)
0.008 A
Number of Inputs
2
Number of Outputs
1
Output Polarity
TRUE
Power Supply Current-Max (ICC)
16 mA
Prop. Delay@Nom-Sup
27 ns
Propagation Delay (tpd)
27 ns
Seated Height-Max
4.44 mm
Supply Voltage-Max (Vsup)
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
Supply Voltage-Nom (Vsup)
5 V
Width
7.62 mm
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