SN74LS605NS
vs
54SHST157FL
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
GEC PLESSEY SEMICONDUCTORS
Package Description
DIP, DIP28,.6
,
Reach Compliance Code
unknown
unknown
JESD-30 Code
R-PDIP-T28
R-CDFP-F16
JESD-609 Code
e0
Logic IC Type
D FLIP-FLOP
MULTIPLEXER
Number of Functions
8
4
Number of Terminals
28
16
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DFP
Package Equivalence Code
DIP28,.6
FL16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
FLATPACK
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
YES
Technology
TTL
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
FLAT
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
Base Number Matches
3
2
HTS Code
8542.39.00.01
Family
HST/T
Number of Inputs
2
Number of Outputs
1
Output Polarity
TRUE
Propagation Delay (tpd)
25 ns
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
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