SN74LS604N
vs
JM38510/30905BFA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
MOTOROLA INC
Package Description
DIP, DIP28,.6
DFP,
Reach Compliance Code
unknown
unknown
JESD-30 Code
R-PDIP-T28
R-GDFP-F16
JESD-609 Code
e0
Logic IC Type
D FLIP-FLOP
MULTIPLEXER
Number of Functions
8
1
Number of Terminals
28
16
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DFP
Package Equivalence Code
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
FLATPACK
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
YES
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
FLAT
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
Base Number Matches
4
4
Part Package Code
DFP
Pin Count
16
HTS Code
8542.39.00.01
Family
LS
Length
9.65 mm
Number of Inputs
8
Number of Outputs
1
Output Polarity
COMPLEMENTARY
Propagation Delay (tpd)
75 ns
Seated Height-Max
2.15 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Width
6.415 mm
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