SN74LS375N
vs
MM74HC112N
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DIP
Package Description
DIP, DIP16,.3
DIP, DIP16,.3
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LS
HC/UH
JESD-30 Code
R-PDIP-T16
R-PDIP-T16
JESD-609 Code
e0
e0
Length
19.175 mm
19.305 mm
Load Capacitance (CL)
15 pF
50 pF
Logic IC Type
D LATCH
J-K FLIP-FLOP
Max I(ol)
0.008 A
Number of Bits
2
2
Number of Functions
2
2
Number of Terminals
16
16
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supply Current-Max (ICC)
12 mA
Prop. Delay@Nom-Sup
27 ns
Propagation Delay (tpd)
25 ns
32 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.44 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.25 V
6 V
Supply Voltage-Min (Vsup)
4.75 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
HIGH LEVEL
NEGATIVE EDGE
Width
7.62 mm
7.62 mm
Base Number Matches
4
3
fmax-Min
21 MHz
Compare SN74LS375N with alternatives
Compare MM74HC112N with alternatives