SN74LS368AN
vs
HD74ACT365FP-EL
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
RENESAS ELECTRONICS CORP
Package Description
DIP, DIP16,.3
SOP,
Reach Compliance Code
unknown
compliant
Control Type
ENABLE LOW
JESD-30 Code
R-PDIP-T16
R-PDSO-G16
JESD-609 Code
e0
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.024 A
Number of Bits
6
6
Number of Functions
2
1
Number of Terminals
16
16
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
INVERTED
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Power Supplies
5 V
Power Supply Current-Max (ICC)
21 mA
Prop. Delay@Nom-Sup
18 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
TTL
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Base Number Matches
7
2
Part Package Code
SOIC
Pin Count
16
HTS Code
8542.39.00.01
Family
ACT
Length
10.06 mm
Number of Ports
2
Propagation Delay (tpd)
10 ns
Seated Height-Max
2.2 mm
Width
5.5 mm
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