SN74LS33J vs TC74HC32AFN-TP1 feature comparison

SN74LS33J Motorola Mobility LLC

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TC74HC32AFN-TP1 Toshiba America Electronic Components

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC TOSHIBA CORP
Part Package Code DIP SOIC
Package Description DIP, DIP14,.3 SOP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS HC/UH
JESD-30 Code R-GDIP-T14 R-PDSO-G14
JESD-609 Code e0
Length 19.495 mm 8.65 mm
Load Capacitance (CL) 45 pF 50 pF
Logic IC Type NOR GATE OR GATE
Max I(ol) 0.024 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Output Characteristics OPEN-COLLECTOR
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Power Supply Current-Max (ICC) 13.8 mA
Prop. Delay@Nom-Sup 32 ns
Propagation Delay (tpd) 28 ns 19 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 5.08 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.25 V 6 V
Supply Voltage-Min (Vsup) 4.75 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology TTL CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 4 3
Pbfree Code No
Rohs Code No
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare SN74LS33J with alternatives

Compare TC74HC32AFN-TP1 with alternatives