SN74LS30J
vs
SN74LS30N
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
MOTOROLA INC
Package Description
DIP, DIP14,.3
646-06
Reach Compliance Code
unknown
unknown
JESD-30 Code
R-XDIP-T14
R-PDIP-T14
JESD-609 Code
e0
e0
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.008 A
0.008 A
Number of Terminals
14
14
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
CERAMIC
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supplies
5 V
Power Supply Current-Max (ICC)
1.1 mA
1.1 mA
Prop. Delay@Nom-Sup
20 ns
20 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
5
6
HTS Code
8542.39.00.01
Family
LS
Length
18.86 mm
Load Capacitance (CL)
15 pF
Number of Functions
1
Number of Inputs
8
Propagation Delay (tpd)
20 ns
Seated Height-Max
4.69 mm
Supply Voltage-Max (Vsup)
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
Width
7.62 mm