SN74LS258BN
vs
S54S157F
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MOTOROLA INC
NXP SEMICONDUCTORS
Part Package Code
DIP
Package Description
DIP, DIP16,.3
DIP, DIP16,.3
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LS
S
JESD-30 Code
R-PDIP-T16
R-GDIP-T16
JESD-609 Code
e0
e0
Length
19.175 mm
Load Capacitance (CL)
45 pF
15 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.024 A
0.02 A
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Output Characteristics
3-STATE
Output Polarity
INVERTED
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supply Current-Max (ICC)
14 mA
78 mA
Prop. Delay@Nom-Sup
21 ns
15 ns
Propagation Delay (tpd)
21 ns
15 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.44 mm
Supply Voltage-Max (Vsup)
5.25 V
5.5 V
Supply Voltage-Min (Vsup)
4.75 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
2
2
Compare SN74LS258BN with alternatives
Compare S54S157F with alternatives