SN74LS158ND vs 74LS158F feature comparison

SN74LS158ND Motorola Semiconductor Products

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74LS158F Philips Semiconductors

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC SIGNETICS CORP
Package Description DIP, DIP16,.3 ,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS LS
JESD-30 Code R-PDIP-T16 R-GDIP-T16
JESD-609 Code e0
Length 19.175 mm
Load Capacitance (CL) 15 pF 15 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.008 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 11 mA 8 mA
Prop. Delay@Nom-Sup 24 ns
Propagation Delay (tpd) 24 ns 24 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.44 mm
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 3 3

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