SN74LS157JS vs HD74LS157P feature comparison

SN74LS157JS Motorola Semiconductor Products

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HD74LS157P Hitachi Ltd

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MOTOROLA INC HITACHI LTD
Package Description DIP, DIP16,.3 DIP, DIP16,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS LS
JESD-30 Code R-GDIP-T16 R-PDIP-T16
JESD-609 Code e0
Length 19.495 mm 19.2 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 70 °C 75 °C
Operating Temperature-Min -20 °C
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 27 ns 14 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.06 mm
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL COMMERCIAL EXTENDED
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Part Package Code DIP
Pin Count 16
Load Capacitance (CL) 15 pF
Max I(ol) 0.008 A
Power Supply Current-Max (ICC) 16 mA
Prop. Delay@Nom-Sup 14 ns

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