SN74LS00ND
vs
TC74HC03AF-EL
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
TOSHIBA CORP
Part Package Code
DIP
SOIC
Package Description
DIP, DIP14,.3
SOP,
Pin Count
14
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LS
HC/UH
JESD-30 Code
R-PDIP-T14
R-PDSO-G14
JESD-609 Code
e0
e0
Length
18.86 mm
10.3 mm
Load Capacitance (CL)
15 pF
50 pF
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.008 A
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Power Supply Current-Max (ICC)
4.4 mA
Prop. Delay@Nom-Sup
15 ns
Propagation Delay (tpd)
15 ns
19 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
4.69 mm
1.9 mm
Supply Voltage-Max (Vsup)
5.25 V
6 V
Supply Voltage-Min (Vsup)
4.75 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
TTL
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
5.3 mm
Base Number Matches
2
3
Pbfree Code
Rohs Code
Output Characteristics
OPEN-DRAIN
Compare SN74LS00ND with alternatives
Compare TC74HC03AF-EL with alternatives