SN74LS00N
vs
T74LS00B1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
STMICROELECTRONICS
Package Description
PLASTIC, DIP-14
PLASTIC, DIP-14
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LS
LS
JESD-30 Code
R-PDIP-T14
R-PDIP-T14
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
15 ns
15 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.25 V
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
7
2
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
14
JESD-609 Code
e0
Load Capacitance (CL)
15 pF
Max I(ol)
0.008 A
Package Equivalence Code
DIP14,.3
Power Supply Current-Max (ICC)
4.4 mA
Prop. Delay@Nom-Sup
15 ns
Schmitt Trigger
NO
Seated Height-Max
5.1 mm
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare SN74LS00N with alternatives
Compare T74LS00B1 with alternatives