SN74HC253DBRE4
vs
74HC253DB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
TEXAS INSTRUMENTS INC
NXP SEMICONDUCTORS
Part Package Code
SOIC
SOIC
Package Description
SSOP, SSOP16,.3
SOT-338-1, SSOP-16
Pin Count
16
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC
HC/UH
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e4
e4
Length
6.2 mm
6.2 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.006 A
Moisture Sensitivity Level
1
1
Number of Functions
2
2
Number of Inputs
4
4
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
SSOP
Package Equivalence Code
SSOP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE, SHRINK PITCH
Packing Method
TR
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Prop. Delay@Nom-Sup
38 ns
Propagation Delay (tpd)
275 ns
53 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2 mm
2 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
NICKEL PALLADIUM GOLD
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Width
5.3 mm
5.3 mm
Base Number Matches
2
2
Compare SN74HC253DBRE4 with alternatives
Compare 74HC253DB with alternatives