SN74HC251PWRE4
vs
MC54HC251J
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description
TSSOP,
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
HC/UH
JESD-30 Code
R-PDSO-G16
R-XDIP-T16
Length
5 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
1
1
Number of Inputs
8
8
Number of Outputs
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
CERAMIC
Package Code
TSSOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
IN-LINE
Propagation Delay (tpd)
375 ns
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.65 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
4.4 mm
Base Number Matches
2
3
Rohs Code
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
Max I(ol)
0.004 A
Package Equivalence Code
DIP16,.3
Power Supplies
2/6 V
Prop. Delay@Nom-Sup
56 ns
Qualification Status
Not Qualified
Terminal Finish
Tin/Lead (Sn/Pb)
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