SN74HC158NSR vs TC74HC158AF feature comparison

SN74HC158NSR Texas Instruments

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TC74HC158AF Toshiba America Electronic Components

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Pbfree Code Yes Yes
Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description SOP-16 SOP, SOP16,.3
Pin Count 16 16
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Texas Instruments
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4 e0
Length 10.2 mm 10.3 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.0078 A 0.004 A
Moisture Sensitivity Level 1
Number of Bits 2
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.3 SOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 0.08 mA
Prop. Delay@Nom-Sup 32 ns 31 ns
Propagation Delay (tpd) 235 ns 125 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 1.9 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 5.3 mm 5.3 mm
Base Number Matches 1 1
Additional Feature ALSO AVAILABLE IN LEADED PACKAGE AS SOP16-P-300-1.27

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