SN74HC158DE4
vs
MC74AC158DR2
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
MOTOROLA INC
Part Package Code
SOIC
SOIC
Package Description
SOP, SOP16,.25
SOP, SOP16,.25
Pin Count
16
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
AC
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e4
e0
Length
9.9 mm
9.9 mm
Load Capacitance (CL)
150 pF
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.006 A
0.024 A
Moisture Sensitivity Level
1
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP16,.25
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Packing Method
TUBE
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
32 ns
10.5 ns
Propagation Delay (tpd)
235 ns
10 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.75 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
3.9 mm
Base Number Matches
2
3
Compare SN74HC158DE4 with alternatives
Compare MC74AC158DR2 with alternatives