SN74HC11PWE4 vs MC54F08JD feature comparison

SN74HC11PWE4 Rochester Electronics LLC

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MC54F08JD Motorola Mobility LLC

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC MOTOROLA INC
Package Description TSSOP, DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH F/FAST
JESD-30 Code R-PDSO-G14 R-GDIP-T14
Length 5 mm 19.495 mm
Logic IC Type AND GATE AND GATE
Number of Functions 3 4
Number of Inputs 3 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code TSSOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Propagation Delay (tpd) 125 ns 7.5 ns
Seated Height-Max 1.2 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS TTL
Temperature Grade INDUSTRIAL MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Width 4.4 mm 7.62 mm
Base Number Matches 2 2
Part Package Code DIP
Pin Count 14
Load Capacitance (CL) 50 pF
Power Supply Current-Max (ICC) 12.9 mA
Qualification Status Not Qualified

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