Findchips: Compare SN74HC00PWE4 vs 74HC00PW,118

SN74HC00PWE4 vs 74HC00PW,118 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Active	Transferred
Ihs Manufacturer	ROCHESTER ELECTRONICS LLC	NXP SEMICONDUCTORS
Package Description	TSSOP,	TSSOP-14
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	HC/UH	HC/UH
JESD-30 Code	R-PDSO-G14	R-PDSO-G14
Length	5 mm	5 mm
Logic IC Type	NAND GATE	NAND GATE
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	85 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TSSOP	TSSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)	115 ns	135 ns
Seated Height-Max	1.2 mm	1.1 mm
Supply Voltage-Max (Vsup)	6 V	6 V
Supply Voltage-Min (Vsup)	2 V	2 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	AUTOMOTIVE
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.65 mm	0.65 mm
Terminal Position	DUAL	DUAL
Width	4.4 mm	4.4 mm
Base Number Matches	2	2
Rohs Code		Yes
Part Package Code		TSSOP
Pin Count		14
Manufacturer Package Code		SOT402-1
JESD-609 Code		e4
Load Capacitance (CL)		50 pF
Max I(ol)		0.004 A
Moisture Sensitivity Level		1
Package Equivalence Code		TSSOP14,.25
Packing Method		TR
Peak Reflow Temperature (Cel)		260
Prop. Delay@Nom-Sup		27 ns
Qualification Status		Not Qualified
Schmitt Trigger		NO
Terminal Finish		Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)		30
	Logic » Gates	Logic » Gates