SN74HC00ADBLE vs MM74HC00N feature comparison

SN74HC00ADBLE Texas Instruments

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MM74HC00N Fairchild Semiconductor Corporation

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Pbfree Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC FAIRCHILD SEMICONDUCTOR CORP
Part Package Code SSOP DIP
Package Description SSOP, 0.300 INCH, PLASTIC, MS-001, DIP-14
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDIP-T14
Length 6.2 mm 19.18 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH IN-LINE
Propagation Delay (tpd) 115 ns 113 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535
Seated Height-Max 2 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Width 5.3 mm 7.62 mm
Base Number Matches 1 2
Rohs Code Yes
Manufacturer Package Code 14LD, MDIP,JEDEC MS-001, .300" WIDE
ECCN Code EAR99
JESD-609 Code e3
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code DIP14,.3
Packing Method RAIL
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 23 ns
Schmitt Trigger NO
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 40

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