SN74F374DBRE4
vs
MC74F374JD
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
SSOP
Package Description
SSOP, SSOP20,.3
DIP, DIP20,.3
Pin Count
20
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
F/FAST
JESD-30 Code
R-PDSO-G20
R-XDIP-T20
JESD-609 Code
e4
e0
Length
7.2 mm
Load Capacitance (CL)
50 pF
Logic IC Type
BUS DRIVER
D FLIP-FLOP
Max Frequency@Nom-Sup
70000000 Hz
70000000 Hz
Max I(ol)
0.024 A
0.024 A
Moisture Sensitivity Level
1
Number of Bits
8
Number of Functions
1
8
Number of Ports
2
Number of Terminals
20
20
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC
Package Code
SSOP
DIP
Package Equivalence Code
SSOP20,.3
DIP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
IN-LINE
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Power Supply Current-Max (ICC)
86 mA
86 mA
Propagation Delay (tpd)
10 ns
Qualification Status
Not Qualified
Seated Height-Max
2 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
NICKEL PALLADIUM GOLD
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.65 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
5.3 mm
Base Number Matches
2
3
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