SN74F30DE4
vs
N74F30D-T
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
NXP SEMICONDUCTORS
Part Package Code
SOIC
SOIC
Package Description
SOP, SOP14,.25
SOP,
Pin Count
14
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
F/FAST
F/FAST
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e4
e4
Length
8.65 mm
8.65 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.02 A
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Inputs
8
8
Number of Terminals
14
14
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Packing Method
TUBE
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Power Supply Current-Max (ICC)
4 mA
4 mA
Prop. Delay@Nom-Sup
5.5 ns
Propagation Delay (tpd)
5 ns
5.5 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
1.75 mm
1.75 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
NICKEL PALLADIUM GOLD
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Width
3.9 mm
3.9 mm
Base Number Matches
1
1
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