SN74CBTK32245GKE vs QS34X245Q3G8 feature comparison

SN74CBTK32245GKE Texas Instruments

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QS34X245Q3G8 Integrated Device Technology Inc

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TEXAS INSTRUMENTS INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA QVSOP
Package Description LFBGA, BGA96,6X16,32 MILLIPAK-80
Pin Count 96 80
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family CBT/FST/QS/5C/B CBT/FST/QS/5C/B
JESD-30 Code R-PBGA-B96 R-PDSO-G80
Length 13.5 mm 20.4978 mm
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 8 8
Number of Functions 4 4
Number of Ports 2 2
Number of Terminals 96 80
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA SSOP
Package Equivalence Code BGA96,6X16,32 SSOP80,.25,20
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 0.35 ns 0.25 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.7526 mm
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL GULL WING
Terminal Pitch 0.8 mm 0.5 mm
Terminal Position BOTTOM DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 5.5 mm 3.9116 mm
Base Number Matches 1 2
Pbfree Code Yes
Manufacturer Package Code DMG80
ECCN Code EAR99
JESD-609 Code e3
Moisture Sensitivity Level 1
Terminal Finish MATTE TIN

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