SN74CBTD3306CPWG4
vs
CBTD3306PWDH-T
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
NXP SEMICONDUCTORS
Part Package Code
SOIC
TSSOP
Package Description
TSSOP, TSSOP8,.25
TSSOP,
Pin Count
8
8
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
CBT/FST/QS/5C/B
CBT/FST/QS/5C/B
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
JESD-609 Code
e4
Length
4.4 mm
4.4 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Moisture Sensitivity Level
1
Number of Bits
1
1
Number of Functions
2
2
Number of Ports
2
2
Number of Terminals
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP8,.25
TSSOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
260
Propagation Delay (tpd)
0.15 ns
0.25 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
40
Width
3 mm
3 mm
Base Number Matches
1
1
Compare SN74CBTD3306CPWG4 with alternatives
Compare CBTD3306PWDH-T with alternatives