SN74BCT373DBRE4
vs
54ABT373/B2A
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SSOP
|
QLCC
|
| Package Description |
SSOP, SSOP20,.3
|
QCCN,
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
BCT/FBT
|
ABT
|
| JESD-30 Code |
R-PDSO-G20
|
S-CQCC-N20
|
| Length |
7.2 mm
|
8.89 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Max I(ol) |
0.064 A
|
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
SSOP
|
QCCN
|
| Package Equivalence Code |
SSOP20,.3
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
CHIP CARRIER
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Prop. Delay@Nom-Sup |
9.5 ns
|
|
| Propagation Delay (tpd) |
9.3 ns
|
7.7 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2 mm
|
1.905 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
5.3 mm
|
8.89 mm
|
| Base Number Matches |
1
|
1
|
| Power Supply Current-Max (ICC) |
|
30 mA
|
|
|
|
Compare SN74BCT373DBRE4 with alternatives
Compare 54ABT373/B2A with alternatives